ADI creates internal silicon PCB for system-in-package ADCs
[ad_1] Dubbed iPassive, “this is a new thing in system-in-package”, ADI field application engineer Thomas Tzscheetzsch told Electronics Weekly at Embedded World in Nuremberg. “The passives are in the silicon, not in poly, real silicon. They are matched to 0.1%, with temperature drift in the same direction, and have 1% absolute accuracy over temperature: -40Read more about ADI creates internal silicon PCB for system-in-package ADCs[…]
