“EnSilica has been growing rapidly over the past two years because we have extended our services from just design services to include managing the whole process of production manufacturing, packaging and testing,” says Ensilica’s David  Doyle,   “this soup to nuts service is proving very popular with customers as turning a chip design into finished chips requires a lot of experience and skills that many OEM don’t have.  However, chips for safety critical applications in the automotive market must be designed and made to a specific set of very high standards.  I am pleased to say that we are putting all the processes into place to provide this service to automotive customers.”

(L to R) Andrew Bennett (Lojixx Director), Ian Lankshear (EnSilica CEO), Richard White (Lojixx Director), David Doyle (EnSilica Commercial Director)

EnSilica has been designing automotive ASICs for eleven years and now needs a partner who can  take an ASIC through all the stages of production, packaging and testing, with every stage meeting automotive standards.

Automotive ICs require detailed documentation to trace chips through every stage.  If a problem occurs, car manufacturers have to recall cars and they want to be able to recall as few as possible to keep costs down, so they need to be able to isolate just those ones with an issue. This may mean being able to trace chips right back to the individual wafer that they came from.