The SOT1233 devices, which the firm calls GX 8 packaging, are only 0.35mm high.
“The GX 8 leadless package addresses the continual trend in electronic systems towards smaller and smaller packages, low-power consumption and low system costs,” said the firm.
It already has 5pin and 6pin logic in the package, in its Mini Logic family.
“Logic devices are used to provide the interface between the different ASICs, and with this new introduction, most AXP, AUP and LVC functions are now available in a GX.”
Chips are sampling now with production planned for Q4 this year.
|4AUP2G125GX||Low-power dual buffer/line driver; 3-state|
|74LVC2G08GX||Dual 2-input AND gate|
|74LVC2G00GX||Dual 2-input NAND gate|
|74AUP2G08GX||Low-power dual 2-input AND gate|
|74AXP1T57GX||Dual supply configurable multiple function gate|
|74AUP2G00GX||Low-power dual 2-input NAND gate|
|74AUP1G74GX||Low-power D-type flip-flop with set and reset; positive-edge trigger|
|74AUP2G126GX||Low-power dual buffer/line driver; 3-state|