TSMC began 7nm production in the first half of 2018, and started generating revenues from the node process in Q3.
The process will account for over 10% of TSMC revenues in 2018.
TSMC is expected to enter volume production of chips using its second-generation 7nm process using EUV in Q1 2019.
Samsung will also have its 7nm node with EUV get ready for volume production Q1.
TSMC and other major pure-play foundries will continue expanding fab capacities through 2023, when the top-4 vendors will see their combined capacities reach 67,078,000 8-inch equivalent wafers annually representing a CAGR of 6.8% in the five-year forecast period.