French and German researchers collaborate on future chip technologies


Photo: Pierre Jayet

Leti CEO, Marie Semaria with Hubert Lakner from Fraunhofer Group for Microelectronics (Photo: Pierre Jayet)

The will support the development of FD-SOI – fully depleted silicon on insulator – advanced semiconductor process technology in Europe.

“The ability to, one, develop key enabling technologies that overcome the formidable technical challenges that our leading technology companies will face, and, two, transfer them quickly to industry, is an essential focus for research institutes and industrials in France and Germany,” said Leti CEO, Marie Semaria.

It is expected the cooperation agreement will be the starting point for a strategic research cooperation of the two countries in order to jointly support the upcoming EC initiative, Important Project of Common European Interest (IPCEI), on micro- and nanoelectronics.

“This will bring our complementary strengths to the task of keeping France and Germany’s microelectronics industries in the forefront – and offer our innovations across Europe,” said Semaria.

Fraunhofer Group for Microelectronics chairman, Hubert Lakner believes that Europe can no longer afford to scatter its research competences.

“For the benefit of industry, joining forces will become more and more important, not only for industry but also for RTOs,” said Lakner.

The agreement was signed today by Leti CEO Marie Semaria and Fraunhofer Group for Microelectronics Chairman Hubert Lakner during Leti Innovation Days, which are marking Leti’s 50th anniversary.

 



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