The fab will kick off on 16nm.
Pilot production is scheduled for H1 2018 with volume production in H2.
It is being equipped to run 20k wpm.
First 7nm tape-outs at TSMC Taiwan are set for H2 2017.
10nm is already in production.
TSMC says its EUV tool has shown it can process 1500 wafers a day for three successive days.