New package increases photodiode pre-reflow shelf life

Osram SFH2200A01 photo diode

“Developers at Osram Opto Semiconductors have significantly improved the moisture sensitivity level,” said Osram, “This applies to storage of the component under defined conditions at a temperature of ≤ 30°C and 60% humidity after the dry packaging has been opened. That corresponds to an MSL of 2. Comparable products have an MSL of 4, which means that after 72 hours there is no guarantee that the component can be soldered without causing damage.”

Footprint is 4.0 x 5.1 x 0.85mm, compared to 4.0 x 6.5 x 1.15mm from the firm;s earlier BPW34S and BPW34FAS.

The large-area surface-mount devices are AEC-Q101-C qualified for automotive use, and are specified for use up to 125°C.

An application foreseen for the diodes, called SFH 2200 A01 and SFH 2200 FA A01, is car windscreen rain sensors. Exept for a daylight filter on the FA version, the devices are identical.

One of the techniques used to boost moisture strength has been using encapsulation material containing silicone, which allows moisture and gases to escape more quickly during soldering. “The flexibility of the silicone in combination with the stability of the plastic package of the component ensures that the photodiodes are particularly robust,” said company marketing manager Ralph Schregle.

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