EPC announces eGaN hits the road for automotive design
[ad_1] Two of the company’s eGaN FETs, the EPC2202 and EPC2203, underwent environmental and bias-stress testing, including humidity testing with bias (H3TRB), high temperature reverse bias (HTRB), high temperature gate bias (HTGB) and temperature cycling. The company reports that the wafer level chip scale (WLCS) package has also passed the same testing standards created forRead more about EPC announces eGaN hits the road for automotive design[…]
