Chomerics makes thermal compound for ECUs and processors
[ad_1] It is intended to provide low thermal impedance at multiple gaps to permit the deployment of commonly used spreaders. It only requires low compressive force to deform under assembly pressure. This is intended to minimise the stress on components, solder joints and leads. It is RoHS compliant and the paste-like material has been manufacturedRead more about Chomerics makes thermal compound for ECUs and processors[…]
